Mechanical Engineer

Rivos
We are looking for a highly motivated Mechanical/Thermal Engineer that will mainly be responsible for performing mechanical design on server hardware using Rivos chips and other electronic components. This position will report to the Thermal/Mechanical Engineering Manager.

What will you do?

  • Responsibilities for this position include but not limited to: 
  • Mechanical design at the component, board and chassis levels.
  • Assembly design including high power ASIC’s, sockets, heat sinks. 
  • Mechanical design of air/liquid cooled heat sinks & exchangers/cold plates.
  • Closely working with board designers to determine dimensions, keep out zones, translate ECAD into MCAD and prepare board layouts.  
  • Collaborating with the other engineering teams (Reliability, SI/PI, Power, General HW) and making necessary changes on mechanical design. 
  • Following the OCP guidelines, understanding the revisions/updates, attending appropriate OCP meetings and applying them to mechanical design of Rivos chassis. 
  • Design of cables and bundling through Rivos chassis at various form factors. 
  • Running FEA analysis at board and chassis levels to ensure Mechanical Integrity.
  • Generating and maintaining BOM. 
  • Working with CM, OEM and ODM’s to develop mockups, test samples and high-volume products.

Desired Skills and Experience:

  • Team player with good communication and interpersonal skills. 
  • Passionate about working in a startup environment, exploring, learning new techniques and applying them to product design.
  • Must have experience with electro-mechanical design for rack mounted fixed & modular server or networking equipment.
  • Must have experience working with CM, OEM and ODM’s.
  • Experience with board/PCB/PWB mechanical design.
  • Experience with cabling/bundling in electronic enclosures. 
  • Experience with various fabrication processes including sheet metal, injection molding, soft and hard tooling. 
  • Familiarity with OCP mechanical design guidelines and design of Colo boxes.  
  • Experience with air & liquid cooling systems. 
  • Experience with tolerance analysis and ASME Y14.5 GD&T guidelines.
  • Expert MCAD and PDM user (NX & Solidworks preferred).
  • Experience with IDF and ECAD-MCAD transfer process.
  • Ability of working on mock up design and preparing test setups and procedures for mechanical and thermal testing.
  • Experience with design and manufacturing of fixtures for experiments, components for prototypes, etc.
  • Good knowledge/use of MS or Google Office Suite.
  • Implementing test plans: setting up and conducting tests or experiments with attention to detail.
  • Good troubleshooting skills with mechanical/thermal design and testing. 

Optional Skills:

  • Familiarity with ANSYS Mechanical.
  • Familiarity with Thermal Design Software, i.e. Ansys IcePak, is a big plus.
  • Familiarity with airflow and/or wind tunnel measurements.  

Education and Experience

  • Minimum education: B.S. degree in Mechanical/Thermal Engineering, Applied Mechanics or Science (Physics).  
  • Minimum 8 years of experience in a product development and/or qualification environment, preferably in electronics/semiconductor industry.

To apply, please visit the following URL:https://jobs.lever.co/rivosinc/357a45a6-c4c4-4695-a455-cca8c0de011c/apply?lever-source=Job%20postings%20feed→

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